In the special “Innovative Manufacturing and Engineering” issue of the Fujitsu Scientific & Technical Journal (FSTJ), one of the white papers discusses in detail the cooling technologies developed for Fujitsu high-end servers. The paper describes the cooling methods at several different levels: server cabinet level, system board level, and CPU package level. In the paper, author Jie Wei describes “the thermal design and development methodology of Fujitsu’s high-performance server PW2500”. 

Mr. Wei also details “cooling technologies and challenges in dealing with high-performance microprocessors having a high-density and asymmetric power dissipation. With the trend towards miniaturization, high performance, and high-density packaging, there will be continuing challenges in developing high-performance, high-efficiency thermal solutions. The industry faces a critical need to enhance conventional cooling technologies and develop more aggressive and cost-effective cooling technologies.” 

To read the entire text of this fascinating article, go to the FSTJ website and select “15. Thermal Management of Fujitsu’s High-Performance Servers”. While you’re visiting the website, be sure to read any of the other articles that may pique your interest.